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Low Profile Heat Sink

IP.com Disclosure Number: IPCOM000060708D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Lee, SW Nutter, SW [+details]

Abstract

One method of thermal enhancement to cool electronic packages is the use of heat sinks which increase heat dissipating surface areas. One disadvantage of a heat sink is the effect it has on the circuit density of an electronic package. One type of heat sink now used for some metallized ceramic modules necessitates the removal of adjacent card positions in the electronic package, thereby reducing the circuit density. There is shown in Fig. 1 a low profile heat sink 1 which is an improvement over existing heat sinks because the removal of the adjacent card is not necessary. The total height of the fins is less than 12 mm with the bottom of the fins close to the card surface. The heat sink 1 is attached to the module, which is not shown, by the spring clip 2.