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Thermo-Mechanical Component-Removal Machine Disclosure Number: IPCOM000060718D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

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Related People

Nguyen, K [+details]


A machine for removing components from printed circuit boards applies heat directly to component leads to melt the solder bond between the lead and the pad before the component is removed from the pad. A number of heat source leads engage the ends of the component leads to transfer heat thereto, and a mechanism for moving the machine to position the heat source leads accurately is provided. It is frequently necessary to remove defective or misplaced components from printed circuit boards. Operators normally use vacuum solder suction devices to suck the solder from the pads when removing small components from the card. When removing larger components, such as modules, operators use fountain solder devices which apply the heat of the solder flow simultaneously with a vertical pulling force to remove the component from the card.