Plastic Ringed High Density "J" Leaded Chip Carrier
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
This design has two parts: a ceramic leaded chip carrier and a plastic "forming ring" which receives it. The carrier 10 is shown in Figs. 1 and 2, while the forming ring 12 is shown in Figs. 3, 4 and 5. This forming ring will act as the inner die member during lead forming, in known fashion. Two lead attach configurations 14, 16 are utilized for this design, as shown in Fig. 2. The inner row 14 of leads are side brazed to the ceramic carrier 10 while the outer row 16 of leads are centered between the inner row and are top brazed to 10. The staggering of the leads 14, 16 allows for tighter ground rules on the ceramic and more relaxed ground rules on the printed circuit card 18 (Fig. 4) where they are required.