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Heat Sink Alignment Pin Disclosure Number: IPCOM000060830D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

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Kulback, SE Powell, LJ [+details]


Technologies involved in high density packaging of circuits on chips have critical operating thermal parameters, particularly in large scale computers, which are ultimately limited by constraints of heat dissipation from the chips via thermal conduction. This article describes a heat transfer loading device which eliminates undesirable spring-load tilt characteristics to enhance thermal conduction of heat from such chips. Conventionally, heat is dissipated by a spring-loaded piston which contacts the back of a chip to provide the main thermal path to a water cooled housing. The contribution of the tilt between the chip and piston to thermal resistance is significant.