Browse Prior Art Database

Module Container

IP.com Disclosure Number: IPCOM000060886D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Cook, LG Gallagher, GM Walsh, TJ [+details]

Abstract

A container is described for storing and transporting semiconductor modules during the manufacturing process. Its design provides a contamination free-environment and isolates the devices from the possibility of electrostatic discharge (ESD). It also functions as an FE (field engineering) work station. The container is depicted in the figure with a shock-absorbing snap-in-place nesting tray 2. The latter serves a dual function. Its flexible construction provides the desired shock absorbency. Its configuration provides a universal nest for the various components. It may handle up to the complete module. The total assembly is conductive with grounding achieved by means of a snap 3 on a grounding cord 5.