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Fast Convolution Operation for Contact Verification in Integrated Circuits

IP.com Disclosure Number: IPCOM000060887D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Dally, WJ Donath, WE Ling, D [+details]

Abstract

In the manufacture of integrated circuit chips, vital components are the contacts generated between different layers of material developed in the process. These different layers may correspond to metal, polysilicon, silicon implanted with different materials such as phosphor, boron, or nitrogen, silicon dioxide with holes in it, and many others. Typically, the description of an integrated circuit consists of sets of shapes to be developed on the different layers. Overlap of two shapes on different layers is often necessary for a contact to be made between the two shapes; however, such an overlap is no guarantee for a successful contact when process variations are taken into account.