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Package for Optoelectronic Devices Disclosure Number: IPCOM000060984D
Original Publication Date: 1986-Jun-01
Included in the Prior Art Database: 2005-Mar-09

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Bachtold, W Greschner, J Oosenbrug, A Schmid, GE Vettiger, P [+details]


Proposed is a package for optical fibers and optoelectric devices that provides for precise and mechanically stable interfaces between fibers and devices mounted on a substrate. The fibers are guided and fixed in place utilizing a cap of photosensitive glass, i.e., a material permitting precise etching of holes using lithographic processes. The figure schematically shows a package in which chips A and B carrying devices such as optical transmitters and receivers or electric circuitry are mounted on a conventional ceramic substrate using solder ball or wire bonding. Depending on the devices, the chips may be bonded face down or face up, using proper bonding techniques, and the fiber connections may be either to the side of the devices (chip A), e.g., for edge-emitting lasers, or to the top (chip B) as, e.g.