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Low-Cost Cold Plate for Cooling Logic Modules and for Power Supplies

IP.com Disclosure Number: IPCOM000061014D
Original Publication Date: 1986-Jun-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Aakalu, NG [+details]

Abstract

A liquid-cooled cold plate (heat sink) can be manufactured at low cost by use of a heat-expandable laminate. The steps in production of such a cold plate are shown in Figs. 1-3. The cross section shown in Fig. 1 depicts a first step. The process involves laminating layers 10, 12 of metal, such as copper and nickel, between which is a special ink 14 printed in a configuration which will ultimately create the flow channel for the liquid. After lamination, the part is fired to convert the ink into high pressure gas and the gas in turn produces a cavity 16. The upper layer 10 is thin, and the bottom layer 12 is thick and stiff. Thus, as shown in Figs. 2 and 3, when the cavity 16 is formed, the deformation is in the top layer and the bottom layer stays flat.