Browse Prior Art Database

Plastic Encapsulated - Tape Automated Bonded Multi-chip Circuit Package

IP.com Disclosure Number: IPCOM000061125D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Chen, JZ Mansuria, MS Reeber, AA Trombly, RR [+details]

Abstract

A technique is described whereby multiple circuit chips, as used in computer systems, are interconnected on polymer tape through the use of thin film circuitization implemented onto the tape. The circuit chips are bonded to polymer tape through an automated gang bonding process and then encapsulated in a plastic module. The technique is unique in that packaging costs are reduced, as compared to prior art, in that the lead frame is eliminated, no outer lead bonding is required and the size of equivalent circuit modules is reduced, allowing greater density in packaging mul tiple circuit chips.