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Single Step, Photoimageable Seed for Electroless Copper Deposition

IP.com Disclosure Number: IPCOM000061163D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Baum, TH Jones, CR Larson, CE [+details]

Abstract

Direct "seeding" of copper deposition through the photoimaging of dimethyl gold (III) acetylacetonate DMG(AcAc) has been achieved using a mercury lamp exposure. The gold complex was applied to a polymer substrate from solution, air dried and exposed with ultraviolet radiation through a step-wedge mask. The substrate was placed into a commercial plating bath (Dynachem) and removed. It was observed that copper plating had occurred in the exposed regions, correlating to the exposed regions. No plating occurred in the unexposed regions. The unexposed material was readily soluble in organic solvents and could easily be removed.