Browse Prior Art Database

Fabrication of High Resolution Embossing Dies

IP.com Disclosure Number: IPCOM000061188D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Krongelb, S Romankiw, LT Schmeckenbecher, AF [+details]

Abstract

This article describes a process for fabricating a high resolution embossing die having very deep patterns with desired wall profile in a hard, abrasion-resistant material such as Mo, Ti, SiC, TiC or WC, which can be subsequently used to press patterns into polymers containing Al2O3, gamma - Fe2O3 or similar abrasive particles. Critical conditions for carrying out the process so as to achieve the desired results are also described.