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Fabrication of High Resolution Embossing Dies Disclosure Number: IPCOM000061188D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

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Krongelb, S Romankiw, LT Schmeckenbecher, AF [+details]


This article describes a process for fabricating a high resolution embossing die having very deep patterns with desired wall profile in a hard, abrasion-resistant material such as Mo, Ti, SiC, TiC or WC, which can be subsequently used to press patterns into polymers containing Al2O3, gamma - Fe2O3 or similar abrasive particles. Critical conditions for carrying out the process so as to achieve the desired results are also described.