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Cold Plate for Thermal Conduction Module With Reduced Water Flow Resistance, Increased Fin Area, and Improved Water Turbulence

IP.com Disclosure Number: IPCOM000061255D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Hwang, UP Purcell, JH Scano, AL [+details]

Abstract

A cold plate for electronic devices has an improved fin pattern for increased heat transfer. Four fins extend from two opposite walls of the cold plate to form a sinuous path for water flow. Each parallel segment of the path is relatively wide and is further divided into four parallel channels by a three by three parallel line of short fins. The gaps between the short fins increase the turbulence in the water flow. The parallel channels provide increased fin area with low flow resistance. The drawing is a top view of a cold plate before the top is attached.