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Automated Thermally Conductive Module Pin Inspection Tool

IP.com Disclosure Number: IPCOM000061278D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Miller, RF [+details]

Abstract

This article describes an electromechanical system for handling and holding thermally conductive module (TCM) pins for inspection wherein five pins per second are processed. In the manufacturing process of a TCM substrate many expensive repairs have been required because of the failure of the pins to meet mechanical specifications. Therefore, a system of determining the integrity of the pins prior to bonding to the substrate needed to be developed. The handling system disclosed herein delivers pins to an optical measuring and inspection system at a rate of five per second. Referring to the drawings, Fig. 1 is a top view of the present handling mechanism. Fig. 2 is an end view, and Fig. 3 is a front view.