Thermal Conduction Module With Wetted Interface Between Hat and Cold Plate Established by Holes in One Element Initially Containing Liquid Displaced by Pins Carried by the Other Element
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
A known thermal conduction module (TCM) has a hat that carries pistons that contact semiconductor chips and carry heat from the chips into the hat structure. A cold plate that carries chilled water is attached to the hat. Where the cold plate and hat fit together, they have accurately machined surfaces, but gaps in the interface between the hat and the cold plate contribute a significant portion of the resistance in the thermal path. It has been proposed to wet the surfaces to fill the gaps. Various liquids are suitable. In one module, a metal foil is interposed between the cold plate and the hat, and the foil has small holes that hold a liquid by capillary action. In another module, the holes have been formed in the surface of the cold plate or the hat.