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Circuit Device With Cooling by Air Directed Toward Fin-Supporting Surface With Fin Height Configured to Maintain Air Velocity As Air Spreads Over Surface

IP.com Disclosure Number: IPCOM000061289D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

A known circuit module has a flat ceramic chip carrier, pins on one side of the chip carrier for electrical connections to a circuit board, and a cap on the other side of the chip carrier to enclose the chips. Heat from the chips flows partly through the cap, and conventionally fins are attached to the cap to transfer the heat to a stream of chilled air. In some systems the air stream is directed to the module at right angles to the surface of the cap. If the fins are in the form of pins, the air spreads evenly along the surface of the cap from the center point where it strikes the surface. If the fins are in the form of two-dimensional strips, the air spreads in opposite directions parallel to the fins. In this module, the fins are higher toward the center point where the air initially strikes the cap.