Substrate Metallurgy Tester
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
In semiconductor manufacturing, the adhesion of the metal-ceramic bond in laminates is critical for proper quality control. This article describes a simplified technique for measuring the adhesion or bondability of the substrates. Standard microweld equipment is used in the process, but it is modified so that the tips are made of tungsten, in place of molybdenum. In addition, the tip dimensions are increased to 10 mils square and the gap between tips increased to 2 mils. The wire to be welded is normal thermistor lead wire, Pt-Ir. Under normal conditions this arrangement results in the wire consistently sticking to the tips after the weld is completed. This adverse condition, which resulted in the arrangement's being rejected for thermistor welding, is what makes this desirable for test purposes.