Browse Prior Art Database

Hybrid I/o Module

IP.com Disclosure Number: IPCOM000061410D
Original Publication Date: 1986-Jun-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Bartley, GK Ryba, JM [+details]

Abstract

A hybrid I/O module incorporates a substrate design that combines two existing module I/O technologies to allow a significantly higher I/O count without an increase in substrate size. The result is achieved with a relatively small cost delta. Until now the pin grid array and the peripheral lead approach of surface mount were mutually exclusive I/O approaches. The hybrid I/O module combines the edge clip used in surface mount components with a standard pin grid array. The drawing shows that normal corner crimped pins are not necessary since the edge clips 10 will determine the module height. Edge clips 10 are attached to module 15 which has standard I/O pins 20. A non-conductive protective cap 30 protects the silicon and leaves room for the edge clips 10.