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Low Inductance Chip Connector for Power Rectifiers

IP.com Disclosure Number: IPCOM000061471D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Miraglia, JA Spreen, JH [+details]

Abstract

Among the problems associated with reliable connections to semiconductor rectifier chips are compensation for the thermal expansion of the materials involved and provision for chip replacement. Referring to the drawings, device 1 includes a flat package semiconductor chip power rectifier 3 (Fig. 2), a compliant contact surface 6 (Fig. 3), and a threaded compression member 7 (Fig. 1). Threaded compression member 7 may be tightened by use of an allen wrench or the like to apply pressure on the semiconductor chip 3 against conductor B which lies beneath semiconductor chip 3. Contact is made between conductors A and B through the diode contained on the chip power rectifier 9. Conductor A may, for example, be connected to a leg of an output transformer or the like, while conductor B may be connected to a ripple filter or a load.