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Pinless Connector System for Circuit Modules

IP.com Disclosure Number: IPCOM000061483D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Franchak, NP Funari, J Rivenburgh, DL [+details]

Abstract

Pinless ceramic circuit modules are connected through input/output (I/O) pads and enable greater circuit density, simplified construction and convenient installation. In the figure, a circuit module 1 has a substrate 1A with conductively filled through-holes 2 and plated I/O pads 3. Substrate 1A carries circuit chips (not shown) and circuit lines (not shown) on its top surface 2A. Surface 2A is sealed and has a protective cap 4 soldered thereon. Module 1 is connected to circuit board 5 through an intermediate insulative carrier 6. Base 7 of carrier 6 has a plurality of spring members 8 molded therein. The top portion 9 of each member 8 is formed and located as a resilient horizontal contact for engaging an I/O pad 3 on module 1.