Polyimide Surface Modification in H2S Plasma
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
The present process allows direct metallization of a polyimide surface with Cu by promoting the chemical component of adhesion between the two layers. The use of polyimide as a dielectric in semiconductor manufacture is well established, as is the use of Cu for conducting circuitry. Ordinarily the adhesion of Cu directly to polyimide is not sufficiently strong, and an additional layer between these layers is required to satisfy adhesion requirements. The present process is to use hydrogen sulfide (H2S) plasma assisted etching to modify the surface of polyimide and thereby enhance adhesion of the polyimide to Cu. The modification via reactive ion etching (RIE) results in the incorporation of sulfur moieties into the polyimide which will then chemically interact with the subsequently applied Cu deposit.