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Planetary Motion Fixture Plate for Thin Film Deposition

IP.com Disclosure Number: IPCOM000061818D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Nowakowski, L [+details]

Abstract

A mechanism has been developed to rotate semiconductor wafers during thin film deposition. This results in improved uniformity of the vaporized material which is being deposited on the wafers. In thin film deposition, the density of the vaporized material is not uniform across the fixture plate nor across the wafers resting in the plate. Because of this, most fixture plates in large evaporators are rotated. However, conventional units do not have the capability of rotating the individual wafer. This development which makes it possible to rotate the individual wafer while the fixture plate is rotating leads to a much improved uniformity of the evaporated coating deposited on the wafers. The planetary motion fixture plate is shown in a plan view in the figure.