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Board-Cleaning Technique Using Hollow Cathode Plasma Discharge

IP.com Disclosure Number: IPCOM000061837D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Cuomo, JJ Rossnagel, SM [+details]

Abstract

Due to the increasing complexity of circuit board construction for use in electronic devices, there has been a trend away from wet or acid cleaning of these boards. In various stages of the manufacturing process, either after a deposition, exposure, or strip, or else following a mechanical step, such as drilling through the boards for the mounting of pins or other interconnects, there is a need to clean the surface and the drilled hole prior to the next manufacturing step. Dry processing such as plasma etching or reactive ion etching, has been successfully used in the past to prevent some of the inherent problems associated with the wet processing of complex, multilayer patterns. These techniques have been used in commercial systems and are in current usage in some manufacturing applications.