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Adhesion Enhancement of Thin Metal Film

IP.com Disclosure Number: IPCOM000061840D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Appleby-Hougham, G Hunt, D Jahnes, C Kim, J Kim, K [+details]

Abstract

Adhesion of a thin metal film to a substrate can be enhanced by simply changing thickness or ductility of the film without requiring any significant change of the current process. When the substrate is coated with a polyimide layer, adhesion of the film to the layer can also be enhanced by changing the layer thickness. In order to enhance adhesion of a thin metal film to a substrate, a so-called adhesion layer is usually deposited onto the substrate before deposition of the film to increase chemical bonding. However, from an engineering point of view, such chemical bonding of the film to the substrate is not a sole factor for good adhesion of the film. This is because the film should be deformed either elastically or elasto- plastically if the film is to be lifted off.