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Surface-Mounted Socket for a Plastic Leaded Chip Carrier

IP.com Disclosure Number: IPCOM000061849D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Smith, TL [+details]

Abstract

Figs. 1 and 2 illustrate a Plastic Leaded Chip Carrier (PLCC) socket to be placed on the same board footprint pad as a PLCC chip. As a result, this socket can be used for chip testing during development. The socket is divided into three parts as follow: 1. cover 2. base 3. pin The top cover has a plastic separator between pins to eliminate shorts and solder bridging. Also, the socket has .026 probing holes and two slots for chip extraction, as show in Fig. 1. The base is built to accommodate four-sided PLCC with pins located on 50-mil centers. The bottom of the base is the same size as an 84- pin (PLCC) chip with pins curling under socket. There are two types of pins that are used for the socket-types A and B (Figs. 1 and 2).