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An arrangement is described which eliminates use of part no. dependent fixturing and expensive pick-place machine by robotic placement of modified Surface Mounted Components (SMC).
English (United States)
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Fixtureless Component Placement And Reflow for Screenless Surface
Mounted Technology Process
An arrangement is described which eliminates use of part no. dependent
fixturing and expensive pick-place machine by robotic placement of modified
Surface Mounted Components (SMC).
Present SMC components are modified by providing two orientation and
registration pins. The pins are part of plastic molded body of the component.
Placement tool/equipment picks up parts and inserts them on surface pattern of
Printed Circuit Board (PCB) where two holes are provided to accept pins, thus
providing positive registration.
The assembled card is then reflowed in vapor phase equipment to complete
the solder joints. The tolerance of the pins is such that a floating action is
maintained for the component to adjust during reflow.
This new arrangement relates to screenless surface mount process to
eliminate use of screen and paste screening equipment by providing required
solder on the pads using immersion wave soldering technique.
The advantages of the arrangement include the elimination of fixturing that
changes with each part number, simpler and inexpensive placement tools, and
that no adhesive is required for holding components.