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The provision of recesses at the location of the heads of pins and respective lands in pinned substrates avoids possible interference with subsequently mounted circuit ch
English (United States)
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Pinned Substrate for Circuit Chip Mounting
The provision of recesses at the location of the heads of pins and respective
lands in pinned substrates avoids possible interference with subsequently
mounted circuit ch
Referring to the figure, substrate 1, such as ceramic, is formed with a recess
2 and metallized land 3 at each pin opening. Land 3 connects with circuit line 4
leading to chip connection pad 5. A pin 6 is inserted, swaged and soldered to the
land. The land can be copper plated in the vicinity of the pin head with the
remaining circuit line 4 chrome plated as a solder stop. Substrate 1 is formed
with curved interfaces 7, 8 between the lines 4 and the lands 3 and pads 5,
respectively. This enhances processing during substrate manufacturing, e.g.
metalization integrity. The recessed pin prevents possible interference with the
edge of a chip that may extend to the pin location. The head of pin 6 is solder
bonded, e.g. PbSn bond 9, to land 3.