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A Novel High Temperature Metal Deposition Lift-off Process Utilizing a Polyimide Structure

IP.com Disclosure Number: IPCOM000061878D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Peterman, S Stanasolovich, D [+details]

Abstract

Hot metal deposition (110ŒC) is currently being utilized to enhance or achieve continuous metal step coverage. The lift-off process is limited by the metal deposition temperature due to characteristics of the resist. The metal coverage could be further improved if the metal deposition temperature could be lifted by 20 to 30ŒC. The modified process as disclosed below would allow higher metal deposition temperatures while at the same time providing an adequate lift-off structure.