Plasma Compatible Composite External Process
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09
The construction of a composite circuit board commonly utilizes a peel-apart copper surface for the development of external circuitry. apart surface is sensitive and poses sev This peel-apart surface is sensitive and poses several manufacturing difficulties. A method of making composites, without peel-apart copper, that is plasma compatible, is accomplished lowing. in the following.