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Plasma Compatible Composite External Process

IP.com Disclosure Number: IPCOM000061932D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Lemon, G Markovich, V McCarthy, W Moschak, P Sissenstein, C [+details]

Abstract

The construction of a composite circuit board commonly utilizes a peel-apart copper surface for the development of external circuitry. apart surface is sensitive and poses sev This peel-apart surface is sensitive and poses several manufacturing difficulties. A method of making composites, without peel-apart copper, that is plasma compatible, is accomplished lowing. in the following.