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Energy Beam Attachment of Leads to Ceramic Chip Carriers Disclosure Number: IPCOM000061941D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09

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Berding, JT Gjone, R [+details]


The article describes a method for welding lead frames to chip carriers. The invention finds use in surface solder packages and solves the problems of distortion in lead frames and thermal hierarchy normally associated with lead attachment. The figure shows a chip carrier 10 having a number of attachment pads 12 arranged along the periphery of the top surface. Also shown is a lead frame 14 attached to a tie bar 16.