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Complete Lead Frame Singulation And Deflashing Method Disclosure Number: IPCOM000061980D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

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Bosley, R Chase, J Phelps, DW Starr, S [+details]


A mechanism and method is described which cuts plastic encapsulated semiconductor modules (plastic modules) away from a frame (singulates the modules), removes plastic flash from the lead frame tie bar, and delivers oriented modules to process carriers.