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Etched Holes in a Substrate for Improvement of Film Adhesion

IP.com Disclosure Number: IPCOM000061981D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Cronin, J [+details]

Abstract

Small holes are etched in a substrate surface prior to deposition of a film to assure adhesion between the film and the substrate. An implementation of this principle is described for assuring adhesion of a metal film deposited by chemical vapor deposition (CVD) on an insulating film. Shallow holes are etched part of the way through the insulating film while via holes are completely opened. Metal deposited by CVD fills all etched ho Metal adhesion is enhanced by the existence of the many holes in the insulating film substrate.