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Thermal Cap With Direct Heat Sink Disclosure Number: IPCOM000061990D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

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Engle, SR Kotrch, GS Modlo, RJ Moore, RJ [+details]


As module devices become larger, denser, and more integrated the problem of removing undesired heat becomes more critical. A method of directly attaching a high efficiency heat sink to a module cap provides improved heat dissipation from large devices.