Browse Prior Art Database

Thermal Cap With Direct Heat Sink

IP.com Disclosure Number: IPCOM000061990D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Engle, SR Kotrch, GS Modlo, RJ Moore, RJ [+details]

Abstract

As module devices become larger, denser, and more integrated the problem of removing undesired heat becomes more critical. A method of directly attaching a high efficiency heat sink to a module cap provides improved heat dissipation from large devices.