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Solder Ring Placement Mechanism

IP.com Disclosure Number: IPCOM000061991D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Yurko, MJ [+details]

Abstract

A device for placing solder rings over the short side of pins on a ceramic substrate first locates the substrate in a locating nest, then picks up the solder rings in specific patterns that correspond to the desired part number (for a variety of pin configurations) and assembles the pins and the solder rings for subsequent soldering. The device works in the following manner.