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A bellows, filled with a thermally conductive fluid, is utilized to remove heat from a chip mounted on a module. The bellows protrude through the cap and remove the heat to the ambient.
English (United States)
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Flowless Fluid Cooling Scheme for Air Cooled Modules
A bellows, filled with a thermally conductive fluid, is utilized to remove heat
from a chip mounted on a module. The bellows protrude through the cap and
remove the heat to the ambient.
A bellows 1, typically made of copper, or an alloy, removes heat from a chip
2, mounted on a module 3 by interfacing it with a thermal grease 4 that provides
electrical isolation but conducts heat. The heat is conducted through the bellows
1 w contains a highly thermal conductive fluid 5 to the ambient. The bellows 1
are filled with fluid 5 to a level commensurate with the thermal expansion
coefficient to prevent bellows 1 from becoming over-pressurized. The bellows 1
The bellows 1 are flexible and provide alignment to chip 2 that may be
By extending through cap 6, to a height of choice, an increased area for heat
transfer is provided to suit thermal transfer needs.
The above described bellows can be utilized on multiple modules by having
the fluid completely surround the individual chips and common to a sealed
bellows. The bellows would be sealed at the cap.