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Flowless Fluid Cooling Scheme for Air Cooled Modules

IP.com Disclosure Number: IPCOM000061997D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Pennell, GF Rathod, MS Timko, N [+details]

Abstract

A bellows, filled with a thermally conductive fluid, is utilized to remove heat from a chip mounted on a module. The bellows protrude through the cap and remove the heat to the ambient.