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Flowless Fluid Cooling Scheme for Air Cooled Modules Disclosure Number: IPCOM000061997D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

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Related People

Pennell, GF Rathod, MS Timko, N [+details]


A bellows, filled with a thermally conductive fluid, is utilized to remove heat from a chip mounted on a module. The bellows protrude through the cap and remove the heat to the ambient.