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Quick-connect Low Profile Heat Sink

IP.com Disclosure Number: IPCOM000061999D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Kasdagly, DG Plucinski, MD Timko, N [+details]

Abstract

A module heatsink that is designed for use in a constricted environment must have a low profile. The heatsink can be thermally enhanced by an overhang that extends the heatsink beyond the module, but this configuration is often difficult to manufacture. The same effect is realized in a multipiece construction that can give similar thermal performance of a single when mounted to either end of a primary heatsink, as described in the following.