Grain Growth As a Method of Improving Life of Pb-5wt%sn Solder
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
It is well known that at temperatures below half of the melting point of a metal or an alloy, atoms diffuse much faster along grain boundaries compared to the diffusion via lattice. Retarding grain boundary diffusion can potentially improve the reliability of Pb-5Wt%Sn solder joints. This may be accomplished by a reduction of the available grain boundary paths for atom transport.