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Grain Growth As a Method of Improving Life of Pb-5wt%sn Solder

IP.com Disclosure Number: IPCOM000062005D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Agarwala, BN [+details]

Abstract

It is well known that at temperatures below half of the melting point of a metal or an alloy, atoms diffuse much faster along grain boundaries compared to the diffusion via lattice. Retarding grain boundary diffusion can potentially improve the reliability of Pb-5Wt%Sn solder joints. This may be accomplished by a reduction of the available grain boundary paths for atom transport.