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Patterning by "rubber Stamping"

IP.com Disclosure Number: IPCOM000062021D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Romankiw, LT [+details]

Abstract

High resolution patterns for printed circuit boards, hybrid circuits or other similar applications can be formed by rubber stamping said patterns onto the dielectric surface. The imprinted pattern can be made catalytically active and can be to plate thick patterns of electroless Cu, Ni, Co, Au, Ag, etc., on top of the stamping after drying and/or curing or after conversion of the applied catalyst containing ink or paste by heat.