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Photoresist Removal by Nucleophilic Agents in Organic Solvents Disclosure Number: IPCOM000062041D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

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Davis, WJ Jacobs, SL Thayer, A [+details]


In the manufacture of semiconductor wafers it is necessary to strip photoresists from the surface of wafers. When the resists are hardbaked conventional stripping systems require a considerable amount of time to achieve the task and are prone to leaving residue on the surface. A new improved photoresist wet stripping system has been developed which is based on the addition of nucleophilic catalysts to a single solvent system, e.g., N-methyl-2-pyrrolidone (NMP). Actual nucleophilic agents used include dimethyl amino pyridine, imidazole, quinuclidine, diazobicyclo octane and hexamethylobetetramine.