Photoresist Removal by Nucleophilic Agents in Organic Solvents
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
In the manufacture of semiconductor wafers it is necessary to strip photoresists from the surface of wafers. When the resists are hardbaked conventional stripping systems require a considerable amount of time to achieve the task and are prone to leaving residue on the surface. A new improved photoresist wet stripping system has been developed which is based on the addition of nucleophilic catalysts to a single solvent system, e.g., N-methyl-2-pyrrolidone (NMP). Actual nucleophilic agents used include dimethyl amino pyridine, imidazole, quinuclidine, diazobicyclo octane and hexamethylobetetramine.