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Dynamic Removal of Residual Solder From Previously Soldered Electrical Connections

IP.com Disclosure Number: IPCOM000062068D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Foster, BJ Kumar, AH Reiley, TC [+details]

Abstract

This disclosure describes a method of solder removal from previously soldered electrical connections by using the forces produced in a centrifuge and simultaneously raising the temperature of the connectors beyond the melting point of the residual solder. The parts to be desoldered are clamped suitably in a centrifuge with the solder removal path pointing on a radius outward from the spin axis. The rate of rotation is set empirically such that the forces developed by the angular velocity of the parts are sufficient to exceed the adhesion characteristics of the solder and the connector base material. The geometry of the previously soldered connections, the mass of the residual solder,the heat gradient and the desired rate of removal will affect the speed required to accomplish the desired results.