Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
A change in the brazing operation used to attach pins to pads on glass/ ceramic (G/C) substrates has been proposed which would use infrared heating as opposed to a slow furnace method. The new method provides a strong connection with fewer ceramic failures than heretofore. In standard brazing procedures thermal conduction module (TCM) pins are joined to basic storage module (BSM) I/O pads on ceramic substrates used in semiconductor devices. A belt furnace is normally used with the substrate in a braze boat passing through a slow uniform heating and slow cooling cycle. The procedure takes about 40 minutes. The proposal suggests the use of an infrared (IR) lamp properly mounted which produces radiation that preferentially heats the substrate.