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Laser Interferometric Monitor of Polymer Thin Film Properties During Device Fabrication

IP.com Disclosure Number: IPCOM000062153D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Feger, C Kaufman, F Saenger, K Tong, HM [+details]

Abstract

Disclosed is an in-situ and versatile process monitor which can measure thermal properties and thickness uniformities of transparent polymer films. The technique of laser interferometry allows one to non-destructively detect small changes in thickness and index of refraction of thin transparent films over reflective substrates from variations in the intensity of laser light reflected from those films [*]. Polymer properties which are relatable to changes in film thickness and/or refractive index include thermal expansion coefficient, stress level, drying/shrinkage rates, solvent intake/swelling/dissolution and thickness uniformity. Polymer films accessible with laser interferometry can be structures ranging in complexity from a single layer on a Si substrate to modules containing multiple levels of thin film wiring.