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Component Placement Verification Through Height Discontinuities

IP.com Disclosure Number: IPCOM000062155D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Grossman, DD Lavin, MA Taylor, RH [+details]

Abstract

Measuring component height by a light scanner and photodetector, and processing the height data by computer, allows automated verification of presence, position and orientation of electronic components after assembly on printed circuit boards. Most current electronic systems are packaged as printed circuit boards on which electronic components (integrated circuits, resistors, capacitors, etc.) are mounted using wave-soldering (for through-hole components) or vapor-phase soldering (for surface-mounted components). An increasing fraction of the cost of electronic systems goes into the assembly of components onto boards. Data-driven, automated machines reduce the cost and time of component placement.