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In-Situ Method to Monitor Lamination Flow Disclosure Number: IPCOM000062163D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

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Gotro, JT Jephson, JR Keusseyan, RL Martin, GC [+details]


The proper flow of resin in the lamination of a multilayer printed circuit board is critical for a number of subsequent operations. Because resin flow is dependent on a variety of conditions that can cause problems, the monitoring of the platen displacement and its alignment, that are used in the lamination process, provides a method of identifying flow variations for corrective action. Lamination is a squeezing flow geometry. A schematic of the geometry is given in Fig. 1.