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Cap Down Pin Grid Array Module Disclosure Number: IPCOM000062234D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

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Related People

Gresko, AR Olsen, RF Viau, TL [+details]


A precut polyimide film is utilized to bond a module cap to a ceramic substrate and to provide a corrosion barrier for the exposed circuit lines on the substrate that are outside the cap area. This package arrangement (cap down) also provides a significant thermal enhancement. The process is accomplished in the following manner.