Browse Prior Art Database

Cap Down Pin Grid Array Module

IP.com Disclosure Number: IPCOM000062234D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Gresko, AR Olsen, RF Viau, TL [+details]

Abstract

A precut polyimide film is utilized to bond a module cap to a ceramic substrate and to provide a corrosion barrier for the exposed circuit lines on the substrate that are outside the cap area. This package arrangement (cap down) also provides a significant thermal enhancement. The process is accomplished in the following manner.