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Method for Applying Polyimide to Ceramic Substrates

IP.com Disclosure Number: IPCOM000062235D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Papathomas, KI Rasile, J [+details]

Abstract

Polyimide is used as an insulating layer in the fabrication of multilayer electronic circuitry. Generally, a first layer of circuitry is fabricated on a substrate, a layer of polyimide is applied over the first layer of circuitry and then a second layer of circuitry is fabricated on top of the polyimide. Interconnection between the layers is achieved by means of vias that etched in the polyimide.