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Removal of Oxide And Surface Passivation of Copper Using Plasma

IP.com Disclosure Number: IPCOM000062242D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Chan, KK Hoffarth, JG Malueg, VJ [+details]

Abstract

In the production of printed circuit boards and semiconductor devices, it is frequently necessary to remove oxide from copper surfaces. One technique for doing this is the use of wet chemical processes including HCl and Benzo Triaz