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Wire Bonding Capillary Tips for High Temperature Applications

IP.com Disclosure Number: IPCOM000062245D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Hodgson, RT Hu, DC [+details]

Abstract

A method has been proposed to make wire bonding capillary tips which may be used in high temperature applications without experiencing the severe oxidation of the tip which normally occurs in air. A silicide protective coating is used to protect the tip.