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Blister-free Lamination Disclosure Number: IPCOM000062246D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

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Yardley, JV [+details]


A lamination method has been developed which utilizes additional release sheets for the top and bottom of laminates fabricated for semiconductor devices. The sliding effect thus realized eliminates wrinkling of the contact sheets and green sheets during lamination.