Particle Detection Process
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
During fabrication processes for integrated circuits, the density of submicron particles contaminating a substrate surface can be easily determined by first plating the particles to produce their enlargement. When the substrate surface is electrically conductive, it serves as one of two electrodes immersed in an electroplating bath and connected to a power supply. If, however, substrate surface is a non-conductor, the substrate is placed in a highly active electroless plating bath.