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Component attachment is simplified by using the excess solder on tinned leads for the bonding material at the lead-solder pad junction.
English (United States)
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Component Soldering Process
Component attachment is simplified by using the excess solder on tinned
leads for the bonding material at the lead-solder pad junction.
In the process, components having depending leads are fed into a tray of
molten solder to tine the leads. A heated gripper then lifts the component from
the tray and properly positions it on a fluxed circuit card for attachment. The
gripper maintains the leads at soldering temperature and the lead ends each
carry a small globule of molten solder to their respective card pads. The card is
maintained at an elevated temperature below the soldering temperature.