Browse Prior Art Database

Component Soldering Process

IP.com Disclosure Number: IPCOM000062266D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Rohr, RL [+details]

Abstract

Component attachment is simplified by using the excess solder on tinned leads for the bonding material at the lead-solder pad junction.